HML1225/hxl1225 0.8a 300/380 voltage scrs igt<200ua description the HML1225/hxl1225 series silicon controlled rectifiers are high performance planner diffused pnpn devices. these parts are intended for low cost high volume applications. absolute maximum ratings (ta=25 c) parameter part no. symbol min max unit test conditions repetitive peak off state voltage hxl1225 HML1225 vdrm vdrm 380 300 - - v v tj=40 c to 125 c (rgk=1k) on-state current it(rms) 0.8 - a tc=40 c average on-state current it(av) 0.5 - a half cycle=180 ,tc=40 c peak reverse gate voltage vgrm 8 - v igr=10ua peak gate current igm 1 - a 10us max gate dissipation pg(av) 0.1 - w 20ms max operating temperature tj -40 125 c storage temperature tstg -40 125 c soldering temperature tsld - 250 c 1.6mm from case 10s max classification of igt rank aa ab ac ad b c HML1225 10-18 ua 12-23 ua 17-28 ua 22-55 ua 45-105 ua - hxl1225 10-18 ua 12-23 ua 17-28 ua 22-55 ua 45-105 ua 95-155 ua electrical characteristics (ta=25 c) parameter symbol min max unit test conditions off-state leakage current idrm - 0.1 ma @vdrm (rgk=1k), tj=125 c off-state leakage current idrm - 5 ua @vdrm (rgk=1k), tj=25 c -1.4v at it=0.4a, tj=25 c on-state voltage vt -2.2v at it=0.8a, tj=25 c on-state threshold voltage vt(to) - 0.95 v tj=125 c on-state slops resistance rt - 600 ohm tj=125 c gate trigger current igt - 200 ua vd=7v gate trigger voltage vgt - 0.8 v vd=7v holding current ih - 5 ma rgk=1k(ohm) latching current il - 6 ma rgk=1k(ohm) critical rate of voltage rise dv/dt 25 - v/us vd=0.67*vdrm(rgk=1k), tj=125 c crtical rate of current rise di/dt 30 - a/us ig=10ma,dig/dt=0.1a/us, tj=125 c gate controlled delay time tgd - 500 ns ig=10ma,dig/dt=0.1a/us commutated turn-off time tg - 200 us tc= 85 c,vd=0.67*vdrm vr=35v,it=it(av) thermal resistance junc.to case r jc 100 - k/w thermal resistance junc. to amb r ja 200 - k/w www.kersemi.com
to-92 dimension *:typical inches millimeters inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.1704 0.1902 4.33 4.83 g 0.0142 0.0220 0.36 0.56 b 0.1704 0.1902 4.33 4.83 h - * 0.1000 - * 2.54 c 0.5000 - 12.70 - i - * 0.0500 - * 1.27 d 0.0142 0.0220 0.36 0.56 1 - * 5 - * 5 e- * 0.0500 - * 1.27 2 - * 2 - * 2 f 0.1323 0.1480 3.36 3.76 3 - * 2 - * 2 notes : 1.dimension and tolerance based on our spec. dated apr. 25,1996. 2.controlling dimension : millimeters. 3.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.if there is any question with packing specification or packing method, please contact your local hsmc sales office. material : ? lead : 42 alloy ; solder plating ? mold compound : epoxy resin family, flammability solid burning class:ul94v-0 3 1 a d b c i 1 e f 2 3 g h 2 style : pin 1.cathode 2.gate 3. anode 3-lead to-92 plastic package hsmc packa g e code : a marking : hsmc logo part number date code product series rank laser mark hsmc logo part number product series ink mark www.kersemi.com
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